Lead-Free Solder Paste
Tamura LF Solder TLF-204 Series are Lead-Free solders paste which consist of non-lead solder powder.
Lead-free solder paste TAPPI technical codes using Lead-free, spherical solder powder and special flux.

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Features
  • * Uses Sn-Ag3%-Cu0.5% alloy composition.
  • * Outstanding Printing Configuration, Stabilized Printability.
  • * Stabilized Wettability on the replica rolex watches shop Gold Plated Land
  • * Reduced Volume of Flux Dispersion & Void Formation.
  • * Air Bubble Generation Preventive Paper Phenol Circuit Board.
  • * Excellent solderability in N2-reflow system & hot air-reflow system.
Availibility
TLF-204-93K
Metal Content:
Sn-Ag3.0%-Cu0.5%
TLF-204-NH (20-38)
Metal Content:
Sn-Ag3.0%-Cu0.5%
TLF-204-SIS (20-38)
Metal Content:
Sn-Ag3.0%-Cu0.5%
TLF-204-93AV
Metal Content:
Sn-Ag3.0%-Cu0.5%